Suzhou Sail Science & Technology Co., Ltd.
5 1

High Quality Diamond Back Grinding Wheel For Silicon Slice Thinning

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Suzhou Sail Science & Technology Co., Ltd.
[China]

Address
81#WEI XIN RD WEITING TOWN Suzhou Jiangsu
Phone
86-0512-62968901
Contact name
Lisa

Quick Information

  • Place of Origin: China

Description

Advantage:

Minimized wafer edge chipping/improved  die strength,Excellent grinding ablity with high feed/Applicable thin wafer 


 Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

High-Quality-Diamond-Back-Grinding-Wheel-For

 Sail  series grinding wheels

1. excllent quality. 

2, steady working 
3. long life time. 
4. high performance

Specification:




http://www.sail-abrasives.com


Packaging & Delivery

  • Packing :Bags or Cartons
  • Delivery Lead Time : 15
  • Minimum Order : 30

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